Monday, October 16, 2006

Taiwan makers to see mixed influence from Sony PS3 PCB orders


With orders for PCBs to be used in Sony's PlayStation 3 (PS3) game consoles, Ya Hsin Industrial will see its sales exceed NT$4 billion (US$120 million) in October, with monthly sales from the orders to average NT$2 billion, according to the Chinese-language Apple Daily.

Unimicron Technology will also benefit from orders for PS3 PCBs, with sales to remain strong through the first quarter of next year, the paper said. Unimicron declined to comment on related shipments, but indicated its sales will remain at a high level in the fourth quarter thanks to rising demand for consumer electronics, the paper added.

Whether the performance of Nan Ya PCB in the fourth quarter will be boosted by PS3 PCB shipments is still unclear, as the actual shipment volumes now from the maker to Sony is still limited, the paper indicated, adding that Compeq Manufacturing's sales may not see significant benefit from the segment until the first quarter of 2007, as its PS3 PCBs are still under verification from Sony.

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PlayStation 3 Details

Suggested retail price by region*
Region Expected pricing at release
Basic Premium
Japan Japan JP¥49,980 Open price
United States United States US$499 US$599
Canada Canada C$549 C$659
Mexico Mexico MXN$7,999 MXN$9,499
European Union Eurozone
(excluding Finland)
499 €599
United Kingdom United Kingdom GB£375† GB£425†
Switzerland Switzerland
CHF 749 CHF 899
Norway Norway
-
5000 NOK
Denmark Denmark 4295 DKK 5495 DKK†
Sweden Sweden
-
5999 SEK
Finland Finland €550 €650
Australia Australia A$829 A$999
New Zealand New Zealand NZ$999†
NZ$1199.95†
The PS3's 3.2 GHz Cell processor, developed jointly by Sony, Toshiba and IBM ("SIT"), is an implementation to dynamically assign physical processor cores to do different types of work independantly. It has a PowerPC-based "Power Processing Element" (PPE) and six accessible 3.2 GHz Synergistic Processing Elements (SPEs), a seventh runs in a special mode and is dedicated to OS security, and an eighth disabled to improve production yields. The PPE, SPE's and other elements ("units") are connected via an Element Interconnect Bus which serves to connect all of the units in a ring-style bus. The PPE has a 512KB level 2 cache and one VMX vector unit. Each of the SPEs is a RISC processor with 128 128-bit SIMD GPRs and superscalar functions. Each SPE contains 256KB of non-cached memory (local storage, "LS") that is shared by program code and work data. SPEs may access more data in the main memory using DMA. The floating point performance of the whole system (CPU + GPU) is reported to be 2.18 TFLOPS[38]. PlayStation 3's Cell CPU achieves 218 GFLOPS single precision float and is reported at around 26 GFLOPS double precision. The PS3 will ship with 256 MB of Rambus XDR DRAM, clocked at CPU die speed.